Description:

2D and 3D X-ray microtomography studies of the internal structure of various objects made of metals and their alloys, carbon and glass-fibre reinforced composite materials, metal composites, plastics and their alloys and other materials.

Description:
Experience in the electromagnetic compatibility assessment: electromagnetic interference sources, search, analysis and recommendations to combat interference, provision of the technical and technological solutions and analysis. Printed circuit boards design analysis of electromagnetic interference and resistance levels. EMI tests, consultations.

Description:

E-beam lithography is a sophisticated technique used to create extremely fine patterns on substrates by directing a focused beam of electrons onto a resist-coated surface. This technique allows for the precise control of feature sizes down to the nanometer scale, making it essential for fabricating advanced semiconductor devices and nanoscale structures. E-beam lithography is highly valued for its ability to produce custom and complex patterns with high resolution.

Description:

Qualitative study of solar cells by ultrasonic methods