The CUBIVAP thermal resistive evaporator is a reliable system designed for the efficient deposition of thin films via thermal evaporation. It is capable of evaporating a wide range of metals. The rotatable substrate holder ensures even film distribution, while precise control over deposition rates and film thickness is achieved through an integrated quartz crystal monitor.

The system is installed in a class ISO5 cleanroom.

• Evaporation Method: Thermal resistive evaporation
• Vacuum Range: High vacuum up to 1E-6 mbar
• Source Material: Supports metals with melting temperature less than W
• Crucible Type: W
• Substrate Holder: Rotatable for uniform coating
• Deposition Rate: Adjustable, dependent on material and process parameters
• Film Thickness Control: Quartz crystal microbalance monitor
• Sample Size Compatibility: Accommodates various substrate sizes and types
• Process Control: Manual