PTVF

Wire bonding using ultrasonic
Description:
Wire bonding equipment uses thin gold or aluminum vires which is pressed onto the contact pads on your device. Using transverse or logitudinal ultrasound vibrations a complex forces of torsion and compression occur. When those forces exceeds elastic forces the wire fuses with the contact pad. Technical specifications: power 10 W, welding frequency from 5 Hz to 60 kHz.

Keywords:
Wire bonding

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