Wire bonding using ultrasonic
Description:
Wire bonding equipment uses thin gold or aluminum vires which is pressed onto the contact pads on your device. Using transverse or logitudinal ultrasound vibrations a complex forces of torsion and compression occur. When those forces exceeds elastic forces the wire fuses with the contact pad. Technical specifications: power 10 W, welding frequency from 5 Hz to 60 kHz.
Wire bonding equipment uses thin gold or aluminum vires which is pressed onto the contact pads on your device. Using transverse or logitudinal ultrasound vibrations a complex forces of torsion and compression occur. When those forces exceeds elastic forces the wire fuses with the contact pad. Technical specifications: power 10 W, welding frequency from 5 Hz to 60 kHz.
Keywords:
Wire bonding
Field of Science:
New production processes, materials and energy efficiency
New production processes, materials and energy efficiency