PTVF

Results of equipment (13)

Description: Surface roughess measuring tool GARANT ST1

Technical specification: Meassuring range up to 350 µm Standarts : ISO/ASME/JIS/and MOTIF

Usage area: For portable use in manufacturing and for stacionary use inthe isnpection room due to baterry and main operaton

Keywords: Surface roughness measuring tool

Description: Metallurgical microscope "Olimpus BX41M"

Technical specification: Increasing from 100 to 500 times

Usage area: Metalls and aloys structure analysis

Keywords: structure, microscope

Description: Network spectrum impendanse analyzator

Technical specification: Frequency 10-500MHz; resolution 1mHz

Usage area: Research work and postgraduate training

Keywords: Frequency, impendance, resolution

Description: Network spectrum impendanse analyzator

Technical specification: Frequency 10-500MHz; resolution 1mHz

Usage area: Research work and postgraduate training

Keywords: Frequency, impendance, resolution

Description: Direct shear machine ADR-1 LO3400/X-10

Technical specification: Soil Direct shear tests, shear tests, Uniaxial pressure tests, Oedometer tests

Usage area: Soil geotechnical testing.

Keywords: Soil Mechanics. soil shear, soil compression, Oedometer tests.

Description: Concrete Covermeter Elcometer 311HT-1

Technical specification: Package includes: Elcometer 331HT-1; Standard fittings finder; Finder densely reinforcement; Finder thick coating; Scanning probe shafts; Electrode Ag / AgCl with 20 m cable; Extension finder.

Usage area: Elcometer for non-destructive methods to evaluate the quality of reinforced concrete structures, the safety valve covering concrete layer thickness, etc.

Keywords: The protective layer of concrete; fixtures; Reinforced concrete structures diagnostics.

Description: The force sensor KAL 300kN

Technical specification: Load measurement of tensile or compressive strength of 0.1 kN to 300 kN.

Usage area: Beam bending testing

Keywords: Bending test beam flexural strength.

Description: 2 channel generator

Technical specification: Two channels generator with individually selectable signal form

Usage area: For student training

Keywords: Generator, output signal form

Description: K850WM Large Chamber Critical Point Dryer

Technical specification: 170mm diameter chamber - optimised for wafer/MEMS drying. Vertical chamber with top-loading and bottom draining - ensures specimens do not become uncovered during drying. Thermoelectric heating - accurate temperature control. Fine control needle valve pressure let down - precise control . Temperature monitoring and control with thermal cut-out protection

Usage area: For wafer/MEMS drying

Keywords: Drying, Wafer, critical point

Description: Hydraulic Station NS-PAS Ser.No. 820

Technical specification: Testing Machine M1 max: 2500 kN, Testing Machine M2 max: 500 kN. Digital Control System type Digicon 2000, no. 06040. Software Package PROTEUS.

Usage area: Material and product testing of compressive and bending.

Keywords: „Walter bai“ (Switzerland) Testing machines.

Description: Mobile robot and grab

Technical specification: 12V; 0,5m/s

Usage area: For student training

Keywords: Mobile, robot, grab

Description: Infrared camera mod. TP8 with the lens, SM: 06207

Technical specification: The TP8 uses a 384 × 288 IR camera and a colour 1280 × 1024 visual camera. High-resolution thermal and visual images taken and saved together in a single file with one name.

Usage area: Building defect detection. Measures surface temperatures. Sets up some of the heat coming out of the building. Chimney leak testing. Electrical panel wiring contacts for verification.

Keywords: Ventilation, infrared, image.

Description: Vertical Milling Center Emco Concept Mill 300

Technical specification: Working area- x-420 mm, y- 330 mm, -z-240 mm. Max. Torque 78 Nm, table size(LxW) 850x325 mm

Usage area: The machine is suitable for cut-down milling and cut-up milling and for drilling work of machinable metals and machinable synthetic

Keywords: Milling center

Results of services (25)

Description: Silicon nitride coatings from plazma using ammonia NH4 and silane SiH4 gases. We can get different hardness and electrical conductivity coatings.

Keywords: PECVD, silicon nitride

Description: Thermally vacuum evaporated thin Cu, Ti, Cr, Al, etc. films, thickness 10-300 nm

Keywords: Thin solid films, physical vapor deposition

Description: Research of mechanical characteristics enables to solve product or structural element suitability. In recent years were offered the investigation of strength characteristics of plastics, composites and other materials (steel, etc.).

Keywords: Structural elements, strength, rigidity, durability

Keywords: Energy Efficiency Audit; Certification of Energy performance of buildings; Multi-purpose selectonovation

Description: Atomic-force microscopy (AFM) or scanning-force microscopy (SFM) is a type of scanning probe microscopy (SPM), with demonstrated resolution on the order of fractions of a nanometer, more than 1000 times better than the optical diffraction limit. The information is gathered by "feeling" or "touching" the surface with a mechanical probe. Technical specifications: maximum scanned area of 110x110 μm, the largest surface height of 22 μm, vertical resolution Z 0.34 nm, horizontal XY resolution of 1.4 nm.

Keywords: Structure, AFM

Description: Multi-purpose selectonovation methods of energy performance of buildings effective solutions.

Keywords: Energy performance of buildings

Description: Critical point drying process is conducted in high pressure (90 bar) by using liquid Carbon Dioxide. At the critical point physical characteristics of liquid and gaseous are not distinguishable. Compounds which are in the critical point can be converted into the liquid or gaseous phase without crossing the interfaces between liquid and gaseous avoiding the damaging effects. Waterfrom your sample can be replaced against liquid carbon dioxide (CO2), whose critical point lies at 31 °C and 74 bar and is suitable for all biological applications. Wafers with up to 150 mm in diameter can be processed with this sytem.

Keywords: CPD, CO2

Description: Design and sertification of Energy performance of buildings, assessment of options

Keywords: Certification of energy performance of buildings

Description: Reactive-ion etching (RIE) is a type of dry etching which has different characteristics than wet etching. RIE uses chemically reactive plasma to remove material deposited on wafers. The plasma is generated under low pressure (vacuum) by an electromagnetic field. High-energy ions from the plasma attack the wafer surface and react with it. Reactive ion etching (RIE) - This is for plasma etching technology used in micro production. Technical specifications: etched with materials: Si, SiO 2 and SiN, etching gas: CF4, CHF3 and SF6, selectivity photoresist :> 02:01, selectivity Si layer:> 02:01.

Keywords: 3D, RIE

Description: Development of computer vision systems for analysis of industrial objects such as control of wire marking, recognition of objects orientation, visual control of assembled modules. Development and research of computer vision systems for measurement of geometric parameters of large objects (furniture plates, control boards, etc.) and detection of defects. Research the possibilities of computer vision application for mobile robots and their grippers control.

Keywords: Computer vision, objects recognition

Description: A scanning electron microscope (SEM) is a type of electron microscope that produces images of a sample by scanning it with a focused beam of electrons. The electrons interact with atoms in the sample, producing various signals that contain information about the sample's surface topography and composition. The electron beam is generally scanned in a raster scan pattern, and the beam's position is combined with the detected signal to produce an image.

Keywords: Structure, SEM

Description: Photo template manufacture using electron beam lithography. Structure scale from 100 nm. Micro and nano structures forming on conductive surfaces.

Keywords: EBL, Lithography, 3D structures

Description: Energy-dispersive X-ray spectroscopy (EDS or EDX) is an analytical technique used for the elemental analysis or chemical characterization of a sample. It relies on an interaction of some source of X-ray excitation and a sample. Its characterization capabilities are due in large part to the fundamental principle that each element has a unique atomic structure allowing unique set of peaks on its X-ray emission spectrum. To stimulate the emission of characteristic X-rays from a specimen, a high-energy beam of charged particles such as electrons or protons, or a beam of X-rays, is focused into the sample being studied. Technical specifications: Detector - SDD (Silicon Drift Detector), energy resolution - 133, 129 and 127 eV (Mn Ka) 1 100 000 cps Calculation stretch - 1 000 000. or more active area - 10 mm2 detectable elements - from boron (5) to americium (95) or better.

Keywords: EDX, spectrometry

Description: Analysis (strength and/or motion) and optimization of the component, device or product. The model can be planar (2D) or/and three-dimensional (3D). Research and studies are carried out by using the analytical and/or numerical engineering methods.

Keywords: Mechanics, analysis, modeling

Description: The research is oriented towards credit risk assessment problems in commercial banks aiming to analyze the factors of business enterprises' credit risk and develop the statistical and artificial intelligence credit risk assessment models. The results can help implement the recommendations of Basel III agreement to evaluate the impact of macroeconomic environment on the ability to meet the financial obligations of companies. The recommendations for commercial banks' credit policy end efficient crediti risk management are based on the statistical analysis of banks' financial indicators, business statistics and state's economic condition.

Keywords: Credit risk management in commercial banks, micro and macro level data statistical analysis, econometrical modeling

Description: Development, design, simulation and prototyping of microelectromechanical systems (MEMS). Proprietary surface micromachining technology (implemented in-house) for MEMS prototyping. Also common silicon bulk micromachining technologies are available. Assembly and testing of prototypes. Implementation and demonstration of MEMS-containing devices and systems.

Keywords: MEMS, sensors and actuators, design and technology

Description: Development of image processing/recognition algorithms. Also includes the use of optoacoustic techniques (such as lasers and ultrasound) for non-destructive diagnostics, measurement and control. Design and implementation of the real-time production line tools with analog or digital signal aquisition.

Keywords: Image processing, image recognition, non-destructive diagnostics

Description: Design, research and adaptation for user demands of flexible automated systems and processes based on application of remote control, checking, measurement and forecast systems. Modelling, simulation and visualization of such systems.

Keywords: Flexible manufacturing production, modelling or processes, robotics, automated control

Description: A dynamic, active competition and often complicated business environment triggers the need to look for not only traditional, but often unconventional solutions for business development and to ensure its stability. Companies are intensively looking for ways to find out customers’ needs and expectations, how to evaluate their satisfaction with the product, what factors are most important in terms of product quality and encourage consumers to be loyal and what shapes the company's exclusive, hard-copied competitive advantage. The studies to get the answers to these questions are very important, but more importantly, to use the results for proactive activities in order to shape the organizational culture, in which a self-governing organization learning gains more permanent status.

Keywords: Business development, product / service quality, the survey of the product need

Description: The successful performance of modern organization is influenced by the effective human resource management that is based on mutual trust between employees and managers and the match of their interests. Job satisfaction is the guarantee for employee good feelings, psychological state and their positive attitudes towards organization. The commitment or loyalty for enterprise is related to the satisfaction of employees' needs and the balance between employer's and employees interests. The experience of Lithuanian enterprises proves that there is one fifth of loyal employees, and more than one third of them think of changing their workplace or work activities. Similarly, insufficient attention to employees' welfare and their needs determines the increasing staff turnover and weakens the competitive advantages of organization. Aiming to overcome the mentioned consequences, it is proposed to organizations to identify the factors that influence employee job satisfaction and to analyse the possibilities to satisfy employees' needs. The result of research is the study on possibilities for increasing employees' job satisfaction and their loyalty for organization.

Keywords: Human resource, job satisfaction, employee loyalty

Description: In engineering, as elsewhere, it is important to identify if the applied problem contains optimization capabilities. Unfortunately it happens too rarely. CONSULTATIONS will consist of stages: 1. the task analysis for possibility of optimization. 2. Identification of the optimization criterion. 3. Selection of the appropriate software. 4. Selection of methods and algorithms . 5. The interpretation of mathematical solution in engineering terms.

Keywords: Optimization, applications, consulting

Description: Design, re-design and improvement of digital, analogue and mixed electronic circuits according to customer's terms. Printed circuit boards (PCB) with embedded computers or FPGA's, including analog and/or hybrid components, can be designed from scratch. Design of multilayered circuit boards with up to 7 layers can be followed by the prototyping and assembly. High level of integration with conductor width/spacing down to 100 micrometers. Open frame components (such as experimental sensors, etc.) can be also assembled with PCB using wire bonding or flip-chip technology. Design and prototyping of light emitting diode lightning modules.

Keywords: Electronic circuits, printed circuit boards, design and prototyping, assembly

Description: Wire bonding equipment uses thin gold or aluminum vires which is pressed onto the contact pads on your device. Using transverse or logitudinal ultrasound vibrations a complex forces of torsion and compression occur. When those forces exceeds elastic forces the wire fuses with the contact pad. Technical specifications: power 10 W, welding frequency from 5 Hz to 60 kHz.

Keywords: Wire bonding

Description: The employee competence development in contemporary organizations is perceived not only as organized and managed training, but also as self-directed, employee initiative and personal traits based learning. This initiative and eagerness has to be supported by organziational leaders, i.e.the self-directed learning culture has to be created and maintained with motivational and strategic actions. The research on self-directed learning culture in organization consists of several diagnostic blocks: 1) the analysis of employee learning motivation and their self-directed learning competences; 2) the research on manifestation of self-directed learning culture characteristiscs. The result of the research is self-assessment tool for employee learning competences, the report on the results and strategic guidelines for developing self-directed learning culture in the organization under research.

Keywords: Self-directed learning, learning culture, employee competence developement

Description: Concurrent development of numerical calculation methods and professional design software for MEMS launched great opportunities for mathematical evaluation of mechanical, electromechanical and acoustic phenomena. Finite element method is an integral part of contemporary mechanical engineering. Modern finite element software package contains thermal, electromagnetic and fluid properties simulation environment. This enables to perform the analysis in multiple energy domains and effectively obtain trans-domain data with informative value comparable to those complex experimental investigations involving studies of materials properties. This fact is particularly significant while creating MEMS mathematical models, because in most of the cases the effective properties of structural materials can be evaluated only by complex indirect measurements or device prototype experimental tests.

Keywords: MEMS, modeling , design, analysis