Description:

E-beam lithography is a sophisticated technique used to create extremely fine patterns on substrates by directing a focused beam of electrons onto a resist-coated surface. This technique allows for the precise control of feature sizes down to the nanometer scale, making it essential for fabricating advanced semiconductor devices and nanoscale structures. E-beam lithography is highly valued for its ability to produce custom and complex patterns with high resolution.

Description:

Cleanrooms are closed spaces with precise control of temperature, humidity, pressure, and the concentration of airborne particles. ISO 14644-1 standard describes 9 cleanroom classes based on the particle concetration. The cleanroom in "Santaka" valley is class ISO5, which means that there are <3520 particles of size >0,5 um per 1 m3 of air inside it. Standards also describe the rules for tool use, personnel protective garments and cleaning procedures to ensure the control of all the relevant ambient conditions. Such strict requirements result in a much higher device yield, especially those with functional elements on the order of micrometers or even nanometers.

Access to cleanroom requires passing a cleanroom introduction and chemical safety courses, as well as relevant tool training.

Description:

Reactive ion etching is performed using an inductively coupled plasma reactive ion etching tool PlasmaTherm Apex SLR (up to 6").