The OAI Hybralign Series 204IR is a mask aligner system used for parallel exposure wafers and wafer chips through a photomask to define microsctructures in UV sensitive resists. It features near-UV and deep-UV operating modes, an IR backside alignment system, and a UV nanoimprint add-on.

The system is installed in a class ISO5 cleanroom.

• Soft and hard contact
• Substrate stage travel:
  • X, Y ±10mm
  • Z 1,500 μm
  • Rotation ±3.5˚
• Mask sizes: 4", 5"
• Wavelengths:
  • UV400: 350-450 nm (NUV)
  • UV300: 280-350 nm (NUV)
  • UV250: 240-260 nm (DUV)
• Lamp power: 500 W
• Shutter timer:
  • 0.1 - 99.0 s at 0.1 sincrements
  • 1 - 999 s at 1 s increments