MMI

Laser interference lithography (LIL), hidden image holograms, 2D-3D holograms, rainbow holograms

Description:
The service provides original hologram fabrication in light sensitive recording media forming sub-micrometer size dimensional variable relief structures (or variable refractive index structures) for document security and brand authentication. Holograms are recorded using the physical object (model) or computer graphics supplied by the customer. Three-dimensional holograms (3D), 2D/ D holograms, hidden image holograms and combined hologram of high degree of protection recording are fabricated using optical tables, optical-mechanical components, controls, lasers and other devices. Combined hologram recording can be made by combining: a) 3D electron beam lithography with 2D/3D holograms, b) dot-matrix holograms with 2D / 3D holograms, c) 2D/3D holograms with hidden image holograms and so on.

ICP RIE: Micro- and nanofabrication by reactive ion etching

Description:

Reactive ion etching is performed using an inductively coupled plasma reactive ion etching tool PlasmaTherm Apex SLR (up to 6").

Optical microscopy

Description:

The optical microscopy service offers imaging techniques for comprehensive morphological material surface characterization, including bright field, dark field, differential interference contrast (DIC), and fluorescence regimes. Both epi-illumination and transmission modes are available, ensuring versatility in sample visualization and analysis. Fluorescence microscopy enables the detection and study of specific fluorescent markers. For experiments requiring precise thermal control, a temperature-controlled sample stage is available, allowing for the observation of dynamic processes under varying conditions.

Spin coating

Description:
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EBL: E-beam lithography

Description:

E-beam lithography is a sophisticated technique used to create extremely fine patterns on substrates by directing a focused beam of electrons onto a resist-coated surface. This technique allows for the precise control of feature sizes down to the nanometer scale, making it essential for fabricating advanced semiconductor devices and nanoscale structures. E-beam lithography is highly valued for its ability to produce custom and complex patterns with high resolution.

Laser microfabrication

Description:

Femtosecond laser micro- and nanofabrication system FemtoLab uses Yb:KGW laser Pharos, emitting 1030 nm, <4W, >270 fs pulses. Laser ablation can be performed using the fundamental wavelength, or higher harmonics (2H 515 nm, 3H 343 nm). Three ablation modes are available:

  • laser beam ablation by moving the sample (position accuracy >100 nm, resolution >1 um, wavlenegths 1030 nm, 515 nm, 343 nm;
  • laser beam ablation on flat and curved surfaces using a galvoscanner (resolution >20 um, wavelength 1030 nm);
  • laser beam ablation using an interference field (periodicity 0.8-1.1 um, variable orientation, wavelength 515 nm).
The system is controlled using SCA software, which allows to define the structure using command lines, import as a raster image, or any vector graphics format. Both focused beam and interference field ablation can be performed on <3 mm thick, <10x10 cm2 area objects. Ablation using a galvoscanner can be performed on 1-2 cm thick, <7x7 cm2 area objects. Curved objects (rods) are held by a rotating horizontal mount, inner diameter 2-4 cm, outer diameter 0-2 cm.

Cleanroom

Description:

Cleanrooms are closed spaces with precise control of temperature, humidity, pressure, and the concentration of airborne particles. ISO 14644-1 standard describes 9 cleanroom classes based on the particle concetration. The cleanroom in "Santaka" valley is class ISO5, which means that there are <3520 particles of size >0,5 um per 1 m3 of air inside it. Standards also describe the rules for tool use, personnel protective garments and cleaning procedures to ensure the control of all the relevant ambient conditions. Such strict requirements result in a much higher device yield, especially those with functional elements on the order of micrometers or even nanometers.

Access to cleanroom requires passing a cleanroom introduction and chemical safety courses, as well as relevant tool training.