The OAI Hybralign Series 204IR is a mask aligner system used for parallel exposure wafers and wafer chips through a photomask to define microsctructures in UV sensitive resists. It features near-UV and deep-UV operating modes, an IR backside alignment system, and a UV nanoimprint add-on.
The system is installed in a class ISO5 cleanroom.
Keywords:
nanofabrication, lithography, photolithography, exposure, nanoimprint lithography (NIL)
New production processes, materials and energy efficiency
- Soft and hard contact
- Substrate stage travel:
- X, Y ±10mm
- Z 1,500 μm
- Rotation ±3.5˚
- Mask sizes: 4", 5"
- Wavelengths:
- UV400: 350-450 nm (NUV)
- UV300: 280-350 nm (NUV)
- UV250: 240-260 nm (DUV)
- Lamp power:
holography and lithography, micro- and nanofabrication