APCIS - Katalogas Site

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Laser interference lithography (LIL), hidden image holograms, 2D-3D holograms, rainbow holograms

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The service provides original hologram fabrication in light sensitive recording media forming sub-micrometer size dimensional variable relief structures (or variable refractive index structures) for document security and brand authentication. Holograms are recorded using the physical object (model) or computer graphics supplied by the customer. Three-dimensional holograms (3D), 2D/ D holograms, hidden image holograms and combined hologram of high degree of protection recording are fabricated using optical tables, optical-mechanical components, controls, lasers and other devices. Combined hologram recording can be made by combining: a) 3D electron beam lithography with 2D/3D holograms, b) dot-matrix holograms with 2D / 3D holograms, c) 2D/3D holograms with hidden image holograms and so on.

Semiconductor surface passivation

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Analysis of optical properties

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Analysis of materials with Raman spectroscopy

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Device for roughness measurement of mechanical surfaces

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Formation and investigations of Schottky and ohmic contacts

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Deposition and investigations of the antireflective films

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Investigations of piezoresistive properties

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Metal, dielectric, semiconductor thin films: deposition by vacuum, plasma and ion assisted methods and investigations

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Testing of fuel cell components ant other dielectric materials using imedance analyzer

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Optical microscopy

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The optical microscopy service offers imaging techniques for comprehensive morphological material surface characterization, including bright field, dark field, differential interference contrast (DIC), and fluorescence regimes. Both epi-illumination and transmission modes are available, ensuring versatility in sample visualization and analysis. Fluorescence microscopy enables the detection and study of specific fluorescent markers. For experiments requiring precise thermal control, a temperature-controlled sample stage is available, allowing for the observation of dynamic processes under varying conditions.

Research and development of microsystems

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AFM: Atomic force microscopy

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Laser microfabrication

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Femtosecond laser micro- and nanofabrication system FemtoLab uses Yb:KGW laser Pharos, emitting 1030 nm, <4W, >270 fs pulses. Laser ablation can be performed using the fundamental wavelength, or higher harmonics (2H 515 nm, 3H 343 nm). Three ablation modes are available:

laser beam ablation by moving the sample (position accuracy >100 nm, resolution >1 um, wavlenegths 1030 nm, 515 nm, 343 nm;
laser beam ablation on flat and curved surfaces using a galvoscanner (resolution >20 um, wavelength 1030 nm);
laser beam ablation using an interference field (periodicity 0.8-1.1 um, variable orientation, wavelength 515 nm).

The system is controlled using SCA software, which allows to define the structure using command lines, import as a raster image, or any vector graphics format. Both focused beam and interference field ablation can be performed on <3 mm thick, <10x10 cm2 area objects. Ablation using a galvoscanner can be performed on 1-2 cm thick, <7x7 cm2 area objects. Curved objects (rods) are held by a rotating horizontal mount, inner diameter 2-4 cm, outer diameter 0-2 cm.

Optical lithography

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Optical lithography is a microtechnology process to structure thin films. The designed layout is exposed through a photomask on a UV-sensitive layer of photoresist coated on a wafer or a wafer chip. Depending on the photoresist polarity, exposed areas will either wash out or remain after a development step. Optical lithography allows to form >1 μm microstructures.