Description:
Ray photoelectron spectroscopy and Auger electron spectroscopy system KRATOS XSAM800
Technical specification:
X-ray sorce - double Al/Mg anode. Area of analysis: 10 mm. Elements detection limits from 0.1% to 5%
Usage area: Quantitative and qualitative surface analysis using X-Ray photoelectron spectroscopy and Auger electron spectroscopy
Keywords: Quantitative and qualitative surface analysis, X-Ray photoelectron spectroscopy (XPS), Auger electron spectroscopy (AES)
Description: X-ray diffractometer D8 Discover, Bruker
Technical specification: Specification: 2.2 kW X-ray tube with Cu anode. Parallel beam/ Bragg-Brentano geometry, Göbel mirror, 2xGe(022) crystal monochromator, rotary absorber, scintillation detector, 1D LynxEye detector, Eulerian cradle (X, Y, Z, Psi, Phi), Chi ir Xi motorized positioning table, X-ray reflectivity acessory, motorized slit accessory, PATHFINDER optics.
Usage area: Qualitative and quantitative analysis of chemical compounds; Ab initio-crystal structure of chemical compounds to identify and clarify; Material microstructure analysis (crystallite sizes, micro-stress, to determine the degree of crystallinity); X-ray diffraction measurements at a sliding angle of the focused (GID); Micro-Diffraction measurements; Small reflectometry and high resolution
Keywords: X-ray diffraction, structure, thin layers, analysis of chemical compounds
Description:
KRATOS molecular beam epitaxy system for GaAs with control.
Technical specification:
Molecular beam epitaxy for GaAs layers computer controled deposited thicknes.
Usage area: Deposition of GaAs epitaxial layers
Keywords: Molecular beam epitaxy, GaAs.
Description: Universal surface analysis system for X-Ray photoelectron spectroscopy, ion scatering spectroscopy, reflection electron energy loss spectroscopy, and angle Resolved XPS (ARXPS)
Technical specification: Monochromatised X-Ray sorce (Al anaode). Elements detection limits from 0.1% to 5%. Lens-defined area lateral resolution from 20 µm to 900 µm. High-resolution parallel imaging spectra from areas down to ~ 5 µm. Elements detection limits from 0.1% to 5%. Sample heating up to 1000 K, sample cooling down to 77 K; vacuum better then 5*10-10 mB.
Usage area: Quantitative and qualitative surface analysis using X-Ray photoelectron spectroscopy, ion scattering spectroscopy, reflection electron energy loss spectroscopy, angle Resolved XPS (ARXPS) with Ar ion surface eching/cleaning possibility
Keywords: X-Ray photoelectron spectroscopy, ion scatering spectroscopy, electron spectroscopy, reflection electron energy loss spectroscopy, Angle Resolved XPS (ARXPS)
Description: Scanning electron microscope
Technical specification: Resolution in high vacuum up to 1.2 nm (30 kV, SE), up to 2.5 nm (30 kV, BSE) and up to 3 nm (1 kV, SE). Three available vacuum regimes: high vacuum (<6E-4 Pa), low vacuum (10-130 Pa), ESEM (10-4000 Pa). Conductive and isolating samples can be investigated.
Usage area: Sample vizualization
Keywords: Microscope, magnification, visualization, scanning electron microscope, SEM, electron microscope, secondary electrons, back scattered electrons, environmental SEM, ESEM, field emission gun, FEG
Description: Electron beam lithography, electron microscope, energy dispersive spectroscopy
Technical specification: Field emission cathode, acceleration voltage variable from 20 V to 30 kV, laser interferometer, dry vacuum system, sample size up to 102x102 mm, electron microscope, surface chemical analysis from Be (Z=4) to Am (95)
Usage area: Nanolithography, electron microscopy, surface chemical analysis
Keywords: Nanolithography, scanning electron microscopy, surface chemical analysis, EDX, EBL, EDS
Description: Atomic force microscope NT-206
Technical specification: operating modes: contact, tapping, non-contact. Lateral magnetic force microscopy. Static / Dynamic force spectroscopy. AFM characteristics: maximum scan field: 15x15μm; measurement matrix to 512x512 pixels, maximum height measurements are 2 micrometers, up to 15 mm in diameter and 5 mm high samples.
Usage area: For study the morphology and local mechanical properties of differents materials surfaces at the nano, micro-scale.
Keywords: AFM, scaning, morphology, topography
Description: Energy dispersive X-Ray analysis
Technical specification: Detectable elements from Boron (5) to Americium (95). Energy resolution 133 eV (Mn K alfa). Spatial resolution < 1 um3. Thermoelectric cooling.
Usage area: Determination of chemical composition , elemnt mapping
Keywords: Chemical composition, energy dispersion, element mapping, microanalysis, x-ray energy dispersion spectrometer, chemical element analysis, chemical element distribution, EDS, EDX
Description: Optical and fluorescence microscope
Technical specification: Wide field oculars, digital imaging, UV fluorescence source
Usage area: Optical and fluorescence microscopy
Keywords: Optical microscope, fluorescence microscope
Description: Lloyd`s mirror holographic lithography setup.
Technical specification: Loyd`s mirror holographic lithography setup. The setup is capable to pattern structures with periods less than 500 nm
Usage area: Holographic lithography, micro-fabrication
Keywords: Laser, UV, holographic lithography, periodical structures, diffraction gratings, interference lithography, lithography, one dimensional, two dimensional three dimensional
Description: solar spectra simulator
Technical specification: AM1.5
Usage area: measurement of photovoltaic properties
Keywords: measurement of photovoltaic properties
Description: vacuum evaporation unit
Technical specification: E-beam gun power up to 5 kW
Usage area: vacuum evaporation, magnetron sputtering
Keywords: vacuum evaporation, magnetron sputtering
Description: vacuum evaporation unit
Technical specification: E-beam gun power up to 5 kW
Usage area: vacuum evaporation
Keywords: vacuum evaporation
Description: RF reactive ion etching system
Technical specification: power 3kW, homogeneous etching area diamater 15 cm
Usage area: reactive ion etching, surface microfabrication
Keywords: reactive ion etching, surface microfabrication
Description: ion etching system
Technical specification: homogeneous etching area diamater 8 cm
Usage area: ion beam etching, surface microfabrication
Keywords: ion beam etching, surface microfabrication
Description: diamond like carbon ion beam synthesis system
Technical specification: ion energy 400-1000 eV
Usage area: diamond like carbon deposition
Keywords: diamond like carbon deposition
Description: Spin coater for the formation of thin layers
Technical specification: Spin speed up to 10000 rpm, duration 1-999 s, temperature 50 - 250ºC, area up to 230x230 mm
Usage area: Thin film formation
Keywords: Spin coating, thin polimer films, photolithography, drying
Description: UV laser
Technical specification: Wavelength 375nm, power 15 mW
Usage area: Holographic lithography, micro-fabrication
Keywords: Laser, UV, holographic lithography, periodical structures, diffraction gratings, interference lithography, lithography, one dimensional, two dimensional three dimensional
Description: Dot-matrix hologram origination system
Technical specification: Size of recoded hologram 200*200 mm , resoliution: 300 dpi, 600 dpi or 1200 dpi, and laser vawelength: 405nm
Usage area: Dot-matrix hologram origination in photoresist layer.
Keywords: Dot-matrix hologram origination, photoresist
Description: Device for multiplication of optical security marks MSM-1
Technical specification: The adhesive layer formation on silicone paper and multilayer polymeric film. Formation speed in the range of 1-6 m/min. Adhesive layer thichness in the range of 1-150 mm. Ability to cut out labels.
Usage area: Fabrication of optical document security intellectual property measures with micro-diffractive elements.
Keywords: Adhesive layer formation
Description: impedance analyzer
Technical specification: frequency 3 µHz-3 MHz. 2-3 elektrode system. Phase: 0,001 °. Sample diameter 16 mm. 2 measurement congurations: "in-plane"and "through-plane".
Usage area: investigations of electrical properties of dielectric films, testing of fuel cells
Keywords: investigations of electrical properties of dielectric films, testing of fuel cells
Description: Mask aligner and nanoimprint lithography
Technical specification: UV400: 350-450 nm; UV300: 280-350 nm; UV250: 240-260 nm. UV nanoimprint lithography, soft and hard contact, photomask size 102x102 and 127x127 mm.
Usage area: Mask alignement, UV exposure, nanoimprint lithography
Keywords: UV light, exposure, photolithography, optical lithography, nanoimprint lithography,
Description: picoammeter / bias source
Technical specification: bias /- 500V current 100 fA - 20 mA
Usage area: I-V measurements
Keywords: I-V measurements
Description: Raman scattering spectrometer Renishaw in Via Spectrometer with accessories
Technical specification: 532 nm, 45 mW semiconductor laser awaking 2400 lines / mm grating, termoelektriškai 1024 pixels cooled CCD Stokes lines measuring range from 100 cm-1 to 8000 cm-1 resolution - better than 1 cm -1. Leica confocal microscope with 3 lenses x20, x50 and x100.
Usage area: Raman scattering spectroscopy can be used for thin layers of powder and aqueous solutions of the investigation. In addition to information about the structure of materials, Raman spectroscopy can be used for some types of stress in thin layers of review. Software complex for Raman scattering spectra in the confocal micro-Raman optical system and luminescence measurements.
Keywords: Raman spectroscopy, materials research, identification
Description: Device for replication of holograms
Technical specification: Formation of relief with submicron (nanometric) dimensions on polymer surface.
Usage area: Formation of micro-relief on polymer surface
Keywords: Micro-relief
Description: dynamic microhardness meter
Technical specification: loads 0.1 – 2000 mN
Usage area: microhardness and Young modulus testing
Keywords: microhardness and Young modulus testing
Description: vacuum evaporation unit
Technical specification: E-beam gun power up to 5 kW
Usage area: vacuum evaporation
Keywords: vacuum evaporation
Description: Spincoater, hotplate and UV curing lamp for formation of thin films
Technical specification: Two step spin-coating process (first 2-18 s, second 3-60 s) with two different speed intervals (first 500-2500 rpm, second 1000-8000 rpm). Hot plate temperature 30-300 deg C, sample size up to 6 inch, temperature resolution 0.1 deg C. UV lamp has 4x6W bulbs, wavelengths 264 nm, 365 nm. The sample up to 4 inch is rotated at 6 rpm.
Usage area: Spin-coater, hotplate, UV curing, thin layer deposition
Keywords: spin-coater, hotplate, UV lamp, thin layers, spin coating, layer formation, UV hardening, UV cross linking, drying
Description: ICP deep reactive etching system,
Technical specification: Homogeneous etching area diameter 15 cm
Usage area: deep reactive ion etching, bulkmicrofabrication
Keywords: deep reactive ion etching, bulkmicrofabrication
Description: Device for multiplication of holograms
Technical specification: Multiplication of optical security marks on silicone paper and multilayer polymeric film. Formation temperature in the range of 70-180 ºC. The width of the tape 106 mm. The length of the tape 1000 m.
Usage area: Fabrication of optical document security intellectual property measures with micro-diffractive elements.
Keywords: Document security
Description: Laser ellipsometer L115
Technical specification: Length of the light wave used is 632.8 nm. Thickness of films possible for analysis is 0.001 - 1 µm. Uncertainty of thickness measurements is ±(0.5 – 1) nm. Accuracy of the refractive index measurements ±0.01.
Usage area: Measurements of refractive index and thickness of the dielectric and semiconducting thin films, semitransparent thin metal films (< 50 nm), polymeric thin films (e.g. photo resist).
Keywords: Laser ellipsometer, thin films, thickness, refraction index
Description: Device for roughness measurement of mechanical surfaces
Technical specification: Measurement accuracy: 1.Ra: 0.03μm~6.3μm/1μ~250μ. 2.Rz: 0.2μm~50.0μm/8μ~999μ. 3.Ry/R max: 0.2μm~25μm/8μ~999μ. •Resolution: 0.01μm/1μ. •Measurement range 0.8mm/0.30”; ANSI 2RC Filter
Usage area: Surface roughness measurements
Keywords: Surface roughness measurements
Description: Langmuir-Blodgett trough and control system
Technical specification: Surface area – 400 cm2 Working area – 318 cm2 Volume – 1000-1050 cm3 Surface pressure sensor – Wilhelmi plate (error 0,1 mN/m)
Usage area: Langmuir-Blodgett trough is used to deposit single or multiple monolayers on a solid substrate.
Keywords: Langmuir-Blodgett trough, thin layers
Description: UV-VIS spektrometer
Technical specification: UV-VIS spektrometer. Spekctral range 360-860 nm, spectral resolution 1.2 nm, USB2
Usage area: Reflection, transmission, absorption measurements in UV-VIS spectral range. Applied in refractive index kinetics measurement stand
Keywords: UV-VIS spectrometer
Description: Universal optical spectroscopy and laser microfabrications system
Technical specification: Yb:KGW laser wavelength is 1030 nm, power 4W, pulse duration 290 fs, energy >0.2 mJ. Fabrication can be performed employing focused first harmonic (1030 nm) second harmonic (515 nm) or third harmonic (3436 nm) of the laser. Fabrication with controlled period (0.8-1.3 um) interference field of second harmonic (515 nm) is alse available in the system. Microfabrication can be performed in 160x160 mm area with 300 nm positioning precision. Speed of the XY tables is up to 300 mm/s, sample wight up to 3 kg. The pump wavelength range of the spectroscopic system is 315-2600 nm, the probe wavelength range is 480-1100 nm. Time resolution 16.67 fs, length of the delay line 1,8 ns, absorbtion detection limit 0.5 mOD
Usage area: Material mikro-/nano- fabrication with focused beam and measurements of absorbtion kinetics.
Keywords: Femtosecond laser, ultra fast laser, laser microfabrication, micromachining, ablation, laser drilling, laser marking, laser engraving, galvoscanner, second harmonic, third harmonic, direct ablation with interference field, holographic lithography, 515, 315, 1030, kinetic spectroscopy, pump-probe spectroscopy, differential absorption spectrometer, differential absorption, ultra fast spectroscopy
Description:
Fiber-optic spectrometer
Technical specification:
spectral range 360 – 940 nm, resolution < 1.5 nm FWHM, pixel resolution < 0.5 nm, light sources – halogen and UV LED (405 nm), software Coach 7
Usage area: Transmittance, absorbance and luminescence measurements in UV-VIS spectral range. Liquids can be analyzed in the standard cuvette, hard transparent samples
Keywords: UV-VIS spectrometer, optical properties
Description:
3D printer
Technical specification:
max. 3D model forming size 98 × 55 × 140 mm, layer thickness 0.025 to 0.1 mm, print speed 30 mm/h, XY-axis positioning accuracy 115 μm, Z-axis positioning accuracy 0.625 μm, laser wavelenght 405 nm, supporting material – LCD resin, software Alfawise W10 Slice, file format: STL
Usage area: 3D model printing, prototyping
Keywords: 3D printer, printing, prototyping
Description: Scanning probe microscopy system JPK NanoWizard 3
Technical specification: Operating modes: contact, intermittent contact or AC or tapping, non-contact, lateral force microscopy, Phase imaging; Force mapping; Quantitative imaging: images of the surface force curve, the force-distance spectroscopy of force-distance volumetric imaging mode, conductivity microscopy. Scanning field 100x100 μm height up to 15 μm.
Usage area: For measurements of the surface topography and the mechanical, electrical and magnetic properties in the air and fluids. For solids, polymers, biological samples and molecular characterization, nanomanipulation and nanolithography. Development and research of advanced new materials and thin films; control of technological processes at the nano-scale.
Keywords: AFM, atomic force microscopy, topography, morphology, nanolithography, nanotechnology, microscopy
Description:
Laser marking system
Technical specification:
laser power 30 W, working area 110 × 110 mm, laser wavelength 10.64 μm, response time 0.5 ms, frequency of pulse 20-100 kHz, marking depth ≤ 0.4 mm, marking speed up to 7000 mm/s, repeatability accuracy ± 0.001mm, beam diameter < 30 μm, rotary annex for marking cylindrical parts, control software EZCAD, graphic format supported BMP, JPG, GIF, TGA, DXF, PLT, PNG, TIF, DST.
Usage area: Laser marking of various materials
Keywords: Laser marking, laser fabrication, microfabrication, ablation, laser cutting, laser engraving, galvo-scanner, fiber laser
Description: Spectroscopic ellipsometer
Technical specification: Spectroscopic ellipsometer covers UV-VIS-NIR spectral range. Available angles for measurements 12-90 deg with 0.01 deg resolution. Possibility to measure with focused beam 70x150 um. High resolution UV-VIS detector covers 190-900 nm range with 0.5 nm resolution, fast UV-VIS detector covers spectral range of 190-900 nm (1024 wavelengths), high resolution NIR detector 800-2000 nm with 3 nm resolution. Automated sample positioning with sample visualization via digital camera.
Usage area: Device is feasible to analyse optical constants (k(λ), n(λ)), thickness of thin isotropic and anisotropic transparent and non-transparent layers on isotropic and anisotropic transparent and non-transparent substrates. It can be also used for evaluations of periodical structures (scatterometry) and absorption kinetics in liquids.
Keywords: Spectroscopic ellipsometer, optical constants, refractive index, absorption coefficient, extinction, dispersion, dispersion curve, thickness determination, ellispometer
Description:
Induction heater for metal melting
Technical specification:
max. temperature 1400 ºC, graphite crucible dimensions (Dinner × H): 3.5 × 8 cm
Usage area: For metal melting
Keywords: Induction heater, metal, melting
Description:
Salt (fog) spray corrosion test chamber can be used for all kinds of material surface treatment, including coating, electroplating, organic and inorganic coating, anodizing, rust proof oil and preservative treatment test of its corrosion resistance, so as to establish the quality of the products.
Technical specification:
test chamber capacity 108 L, Max volume of salt solution 15 L, test chamber size 107 × 60 × 118 cm, spray quantity 1.0~2.0 ml / 80 cm2 / hour.
Usage area: For probing corrosion resistance properties of various materials
Keywords: Salt spray, corrosion, test, fog
Description:
Four-point probe measurement system
Technical specification:
voltage range 100 μV to 10 V, current range 1 μA to 200 mA, sheet resistance range 100 mΩ/□ to 10 MΩ/□, probe spacing 1,27 mm, max. sample dimensions 60 × 60 mm, max. sample thickness 10 mm, software Ossila Sheet Resistance Lite
Usage area: For measurement of sheet resistance and electrical conductivity
Keywords: Four-point probe measurement system, sheet resistance, electrical conductivity
Description:
Centrifuge
Technical specification:
max. speed 10000 rpm, max. volume 6 × 100 ml, max. RCF 19040 g, timer 0 – 99 min, speed accuracy ± 20 rpm.
Usage area: For phase separation
Keywords: Centrifugation, centrifuge, phase separation
Description:
Vacuum drying oven
Technical specification:
internal volume 50 L, max. load per oven 20 kg, temperature range ≥ 5 – 200 ⁰C, heating up to 150 ⁰C – 106 min, vacuum (absolute) < 6 × 10-1 mbar
Usage area: For sample drying or storing at specific conditions
Keywords: Vacuum, drying, oven, heating, thermal treatment, storing
Description:
Rotary evaporators are mainly used in pharmaceutical, chemical and biopharmaceutical industries for efficient and gentle removal of solvents from samples by evaporation, and solvent recovery. Its advantages come from the fact that rotation of the flask artificially increases the surface area of the solvent and effectively suppresses bumping while decreased pressure facilitates rapid solvent removal at low temperatures. Evaporator has automated jacks and advanced temperature control features.
Technical specification:
speed range from 20 to 280rpm, and interval operation in clockwise and anticlockwise directions for drying process. 5L heating bath with wide temperature range from room temp. to 180°C. Digital display of both rotation speed and heating temperature allows for optimal control of all distillation processes. Patented condenser (cooling surface 1500cm²) with excellent cooling effect.
Usage area: Removal of solvents from samples by evaporation, and solvent recovery
Keywords: Rotary evaporator, solvent evaporation, recovery
Description:
Infrared thermometer
Technical specification:
temperature range 32 – 1100 °C, accuracy 1.5 %, repeatability 0.7 °C, D:S ratio 20:1, response time 250 ms, adjustable emissivity 0.1~1.0, spectral response 8 – 14 μm, laser power < 1 mW
Usage area: For temperature measurement
Keywords: Infrared, thermometer
Description: The fiber-optic spectrometer AvaSpec-2048
Technical specification: Light source - deuterium and halogen. The spectral region 172-1100 nm, resolution - 1.4 nm. USB2
Usage area: Reflection, transmission, absorption measurements in UV-VIS-NIR spectral range. Liquids can be analyzed in the standard cell, hard transparent (measured transmission and the absorption) or vague (measured reflection) samples
Keywords: UV-VIS-NIR spektrometer
Description: Optical microscope NIKON (analyzer)
Technical specification: Magnification up to x1200, uncertainty of measurements do not exceeds (0.1 L/500) µm, where L is length of the structure under measurement.
Usage area: Measurement of linear dimensions of the transparent structures in manual and automatic modes with high fidelity
Keywords: Optical microscope, manual and automatic modes
Description: microwave plasma enhanced chemical vapor deposition system
Technical specification: plasma source diameter 6", power 6 kW frequeency 2.45 GHz homogeneous deposition area diameter 5 cm
Usage area: thin film and coating deposition
Keywords: thin film and coating deposition
Description: Device for galvanoplastic multiplication
Technical specification: Formation of Ni film on polymeric surface
Usage area: Fabrication of Ni replica matrix with submicron (nanometric) precision and high diffraction efficiency of the final product.
Keywords: Galvanoplastic
Description: Fourier transform infrared spectrometer
Technical specification: Fourier transform infrared spectrometer spectra region 400-4000cm-1 Resolution - 1 cm -1. Measurement mode - transmittance, 30-degree reflection, diffuse reflection, total internal reflection (ATR)
Usage area: Characterization of molecules and mixtures, vibrational spectra identification. May be performed thin films, powders, liquid state materials research
Keywords: FTIR spektroskopy
Description: null
Keywords: Optical and nanoimprint lithography
Description: null
Keywords: metal, dielectric, semiconductor, thin films, deposition by vacuum, plasma and ion assisted methods and investigations; structure, mechanical,electrical and optical properties
Description: null
Keywords: Surface roughness measurements
Description: null
Keywords: X-Ray photoelectron spectroscopy, ion scatering spectroscopy, electron spectroscopy, reflection electron energy loss spectroscopy
Description: null
Keywords: Schottky contacts, ohmic contacts
Description: null
Keywords: antireflective films
Description: null
Keywords: piezoresistive properties
Description: null
Keywords: Adhesive layer formation
Description: The service provides original hologram fabrication in light sensitive recording media forming sub-micrometer size dimensional variable relief structures (or variable refractive index structures) for document security and brand authentication. Holograms are recorded using the physical object (model) or computer graphics supplied by the customer. Three-dimensional holograms (3D), 2D/ D holograms, hidden image holograms and combined hologram of high degree of protection recording are fabricated using optical tables, optical-mechanical components, controls, lasers and other devices. Combined hologram recording can be made by combining: a) 3D electron beam lithography with 2D/3D holograms, b) dot-matrix holograms with 2D / 3D holograms, c) 2D/3D holograms with hidden image holograms and so on.
Keywords: Laser interference lithography, hologram origination
Description: We can make products from stickers (in many different shapes of self-decaying seals) to difficult optic changing holograms. We do: projecting holographic signs and manufacturing of original; manufacturing of metal stamp; micro relief on metal polymeric band; making an adhesive layer and cutting holographic sticker in shape you need. Products are made in high technologies: interference holographic lithography, electronic nano–lithography, optic micro lithography, vacuum and electrochemical covers and other modern equipment and technology.
Keywords: Holographic
Description: null
Keywords: diamond like carbon
Description: null
Keywords: Microhardness and other micromechanical properties
Description: null
Keywords: diamond like carbon
Description: null
Keywords: semiconductor, surface, passivation
Description: null
Keywords: chemical bonds identefication
Description: null
Keywords: Galvanoplastic
Description: null
Keywords: surface, nonostructures, nonocomposites, thin films
Description: null
Keywords: Electron beam lithography
Description: null
Keywords: conductivity, impedance spectroscopy, DC measurements
Description: null
Keywords: X-Ray photoelectron spectroscopy, Auger electron spectroscopy
Description: null
Keywords: lateral, magnetic, electric forces microscopy, mapping, mechanical properties, nanotechnology
Description: null
Keywords: Dot-matrix hologram, photoresist