Description:

Reflection, transmission, absorption measurements in UV-VIS-NIR spectral range.  Liquids can be analyzed in the standard cell, hard transparent (measured transmission and the absorption) or vague (measured reflection) samples

Technical specification:

Light source - deuterium and halogen. The spectral region 172-1100 nm, resolution - 1.4 nm. USB2

Usage area: material characterization and analysis

Keywords: UV-VIS-NIR spektrometer

Description:

Measurement of linear dimensions of the transparent structures in manual and automatic modes with high fidelity

Technical specification:

Magnification up to x1200, uncertainty of measurements do not exceeds (0.1 L/500) µm, where L is length of the structure under measurement.

Usage area: microscopy and imaging

Keywords: Optical microscope, manual and automatic modes

Description:

microwave plasma enhanced chemical vapor deposition system

Technical specification:

plasma source diameter 6", power 6 kW frequeency 2.45 GHz homogeneous deposition area diameter 5 cm

Usage area: thin film deposition and coating

Keywords: thin film and coating deposition

Description:

Energy dispersive X-Ray analysis, Determination of chemical composition , elemnt mapping

Technical specification:

Detectable elements from Boron (5) to Americium (95). Energy resolution 133 eV (Mn K alfa). Spatial resolution < 1 um3. Thermoelectric cooling.

Usage area: material characterization and analysis, microscopy and imaging

Keywords: Chemical composition, energy dispersion, element mapping, microanalysis, x-ray energy dispersion spectrometer, chemical element analysis, chemical element distribution, EDS, EDX

Description:

Fabrication of Ni replica matrix with submicron (nanometric) precision and high diffraction efficiency of the final product.

Technical specification:

Formation of Ni film on polymeric surface

Usage area: thin film deposition and coating, micro- and nanofabrication

Keywords: Galvanoplastic

Description:

Atomic force microscope NT-206

Technical specification:

operating modes: contact, tapping, non-contact. Lateral magnetic force microscopy. Static / Dynamic force spectroscopy. AFM characteristics: maximum scan field: 15x15μm; measurement matrix to 512x512 pixels, maximum height measurements are 2 micrometers, up to 15 mm in diameter and 5 mm high samples.

Usage area: material characterization and analysis, microscopy and imaging

Keywords: AFM, scaning, morphology, topography

Description:

Lloyd`s mirror holographic lithography setup.

Technical specification:

Loyd`s mirror holographic lithography setup. The setup is capable to pattern structures with periods less than 500 nm

Usage area: holography and lithography, micro- and nanofabrication

Keywords: Laser, UV, holographic lithography, periodical structures, diffraction gratings, interference lithography, lithography, one dimensional, two dimensional three dimensional

Description:

-

Technical specification:

-

Usage area: material characterization and analysis, microscopy and imaging

Keywords: Optical microscope, fluorescence microscope

Description:

Characterization of molecules and mixtures, vibrational spectra identification. May be performed thin films, powders, liquid state materials research

Technical specification:

Fourier transform infrared spectrometer spectra region 400-4000cm-1 Resolution - 1 cm -1. Measurement mode - transmittance, 30-degree reflection, diffuse reflection, total internal reflection (ATR)

Usage area: material characterization and analysis

Keywords: FTIR spectroscopy

Description:

solar spectra simulator for measurement of photovoltaic properties

Technical specification:

AM1.5

Usage area: material characterization and analysis

Keywords: measurement of photovoltaic properties

Description:

KRATOS molecular beam epitaxy system for GaAs with control.

Technical specification:

Molecular beam epitaxy for GaAs layers computer controled deposited thicknes.

Usage area: thin film deposition and coating

Keywords: Molecular beam epitaxy, GaAs.

Description:

ion etching system

Technical specification:

homogeneous etching area diamater 8 cm

Usage area: micro- and nanofabrication

Keywords: ion beam etching, surface microfabrication

Description:

RF reactive ion etching system

Technical specification:

power 3kW, homogeneous etching area diamater 15 cm

Usage area: thin film deposition and coating, micro- and nanofabrication

Keywords: reactive ion etching, surface microfabrication

Description:

diamond like carbon ion beam synthesis system

Technical specification:

ion energy 400-1000 eV

Usage area: thin film deposition and coating

Keywords: diamond like carbon deposition

Description:

UV laser

Technical specification:

Wavelength 375nm, power 15 mW

Usage area: holography and lithography

Keywords: Laser, UV, holographic lithography, periodical structures, diffraction gratings, interference lithography, lithography, one dimensional, two dimensional three dimensional

Description:

Dot-matrix hologram origination system

Technical specification:

Size of recoded hologram 200*200 mm , resoliution: 300 dpi, 600 dpi or 1200 dpi, and laser vawelength: 405nm

Usage area: holography and lithography, micro- and nanofabrication

Keywords: Dot-matrix hologram origination, photoresist

Description:

Device for multiplication of optical security marks MSM-1. Fabrication of optical document security intellectual property measures with micro-diffractive elements. The adhesive layer formation on silicone paper and multilayer polymeric film. 

Technical specification:

Formation speed in the range of 1-6 m/min. Adhesive layer thichness in the range of 1-150 mm. Ability to cut out labels.

Usage area: micro- and nanofabrication

Keywords: Adhesive layer formation

Description:

investigations of electrical properties of dielectric films, testing of fuel cells

Technical specification:

frequency 3 µHz-3 MHz. 2-3 elektrode system. Phase: 0,001 °. Sample diameter 16 mm. 2 measurement congurations: "in-plane"and "through-plane".

Usage area: electrical measurement and testing, material characterization and analysis

Keywords: investigations of electrical properties of dielectric films, testing of fuel cells

Description:

picoammeter / bias source

Technical specification:

bias /- 500V current 100 fA - 20 mA

Usage area: electrical measurement and testing

Keywords: I-V measurements

Description:

dynamic microhardness meter

Technical specification:

loads 0.1 – 2000 mN

Usage area: material characterization and analysis

Keywords: microhardness and Young modulus testing

Description:

Formation of micro-relief on polymer surface

Technical specification:

Formation of relief with submicron (nanometric) dimensions on polymer surface.

Usage area: micro- and nanofabrication

Keywords: Micro-relief

Description:

vacuum evaporation unit

Technical specification:

E-beam gun power up to 5 kW

Usage area: thin film deposition and coating, micro- and nanofabrication

Keywords: vacuum evaporation

Description:

Fabrication of optical document security intellectual property measures with micro-diffractive elements.

Technical specification:

Multiplication of optical security marks on silicone paper and multilayer polymeric film. Formation temperature in the range of 70-180 ºC. The width of the tape 106 mm. The length of the tape 1000 m.

Usage area: micro- and nanofabrication

Keywords: Document security

Description:

Reflection, transmission, absorption measurements in UV-VIS spectral range. Applied in refractive index kinetics measurement stand

Technical specification:

UV-VIS spektrometer. Spectral range 360-860 nm, spectral resolution 1.2 nm, USB2

Usage area: material characterization and analysis

Keywords: UV-VIS spectrometer

Description:

Device for roughness measurement of mechanical surfaces

Technical specification:

Measurement accuracy: 1.Ra: 0.03μm~6.3μm/1μ~250μ. 2.Rz: 0.2μm~50.0μm/8μ~999μ. 3.Ry/R max: 0.2μm~25μm/8μ~999μ. •Resolution: 0.01μm/1μ. •Measurement range 0.8mm/0.30”; ANSI 2RC Filter

Usage area: material characterization and analysis

Keywords: Surface roughness measurements

Description:

Langmuir-Blodgett trough and control system. Langmuir-Blodgett trough is used to deposit single or multiple monolayers on a solid substrate.

Technical specification:

• Surface area: 400 cm2
• Working area: 318 cm2
• Volume: 1000 - 1050 cm3
• Surface pressure sensor – Wilhelmi plate (error 0,1 mN/m)
• Well dimensions: 
  • Depth: 75 mm
  • Diameter: 60 mm

Usage area: thin film deposition and coating

Keywords: Langmuir-Blodgett trough, thin layers

Description:

A laser ellipsometer is a precision optical instrument used to measure the thickness and optical properties of thin films on surfaces. It employs polarized laser light, which reflects off the sample, and analyzes changes in the polarization state to determine parameters such as refractive index and film thickness. This non-destructive technique is widely used in materials science, semiconductor manufacturing, and surface chemistry for characterizing surfaces at the nanometer scale.

Technical specification:

• Wavelength 632.8 nm
• Thickness range 0.001 - 1 µm
• Uncertainty of thickness measurements ±(0.5 – 1) nm
• Accuracy of the refractive index measurements ±0.01.

Usage area: material characterization and analysis

Keywords: laser ellipsometer, thin films, refractive index

Description:

Quantitative and qualitative surface analysis  using X-Ray photoelectron spectroscopy and Auger electron spectroscopy  

Technical specification:

X-ray sorce - double Al/Mg anode. Area of analysis: 10 mm. Elements detection limits from 0.1% to 5%

Usage area: material characterization and analysis

Keywords: Quantitative and qualitative surface analysis, X-Ray photoelectron spectroscopy (XPS), Auger electron spectroscopy (AES)

Description:

The Universal Optical Spectroscopy and Laser Microfabrication System combines advanced laser microfabrication capabilities with precise optical spectroscopy, making it suitable for a wide range of applications. It uses an ultrafast Yb:KGW laser to enable precise material processing at various wavelengths, including its harmonics, and can handle large sample areas with high positioning accuracy. Additionally, the system offers exceptional control over fabrication patterns and supports detailed spectroscopic analysis across a broad spectral range, making it ideal for both cutting-edge research and industrial microfabrication tasks.

Technical specification:

• Laser Source: Yb:KGW
• Fundamental wavelength: 1030 nm
• Power: 4 W
• Pulse Duration: >290 fs
• Energy: <0.2 mJ
• Laser microfabrication:
  • Harmonic Options for Fabrication:
    • First Harmonic: 1030 nm
    • Second Harmonic: 515 nm
    • Third Harmonic: 343 nm
  • Controlled Period Fabrication: 0.8–1.3 µm interference field (515 nm)
  • Microfabrication Area: 160 x 160 mm
  • Positioning Precision: 300 nm
  • XY Table Speed: Up to 300 mm/s
  • Sample Weight Capacity: Up to 3 kg
• Transient absoption measurements:
  • Spectroscopy Pump Wavelength Range: 315–2600 nm
  • Spectroscopy Probe Wavelength Range: 480–1100 nm
  • Time Resolution: 16.67 fs
  • Delay Line Length: 1.8 ns
  • Absorption Detection Limit: 0.5 mOD

Usage area: material characterization and analysis, holography and lithography, micro- and nanofabrication

Keywords: Femtosecond laser, ultra fast laser, laser microfabrication, micromachining, ablation, laser drilling, laser marking, laser engraving, galvoscanner, second harmonic, third harmonic, direct ablation with interference field, holographic lithography, 515, 315, 1030, kinetic spectroscopy, pump-probe spectroscopy, differential absorption spectrometer, differential absorption, ultra fast spectroscopy

Description:

Used for mixing polydimethysiloxane (PDMS) monomer and its curing agent at a ratio 10:1. Single-use static mixers are used to mix and dispense the components.

Technical specification:

• Mixing volume: >1 ml

Usage area: mixing and chemical processing

Keywords: polydimethylsiloxane (PDMS), mixing, dispenser

Description:

Transmittance, absorbance and luminescence measurements in UV-VIS spectral range. Liquids can be analyzed in the standard cuvette, hard transparent samples

Technical specification:

• Spectral range: 360 – 940 nm
• Resolution: < 1.5 nm FWHM
• Pixel resolution: < 0.5 nm
• Light sources: halogen and UV LED (405 nm)
• Software: Coach 7

Usage area: material characterization and analysis

Keywords: UV-VIS spectrometer, optical properties

Description:

3D printer - Alfawise W10

Technical specification:

• Max. 3D model forming size: 98 × 55 × 140 mm
• Layer thickness: 0.025 to 0.1 mm
• Print speed: 30 mm/h
• XY-axis positioning accuracy: 115 μm
• Z-axis positioning accuracy: 0.625 μm
• Laser wavelenght 405 nm
• Printing material – LCD resin
• Software Alfawise W10 Slice
• File format: STL

Usage area: 3D printing and fabrication

Keywords: 3D printer, printing, prototyping

Description:

Laser marking system

Technical specification:

laser power 30 W, working area 110 × 110 mm, laser wavelength 10.64 μm, response time 0.5 ms, frequency of pulse 20-100 kHz, marking depth ≤ 0.4 mm, marking speed up to 7000 mm/s, repeatability accuracy ± 0.001mm, beam diameter < 30 μm, rotary annex for marking cylindrical parts, control software EZCAD, graphic format supported BMP, JPG, GIF, TGA, DXF, PLT, PNG, TIF, DST. 

Usage area: holography and lithography, micro- and nanofabrication

Keywords: Laser marking, laser fabrication, microfabrication, ablation, laser cutting, laser engraving, galvo-scanner, fiber laser

Description:

Induction heater for metal melting

Technical specification:

max. temperature 1400 ºC, graphite crucible dimensions (D_inner × H): 3.5 × 8 cm

Usage area: heat treatment and thermal processing

Keywords: Induction heater, metal, melting

Description:

Hardness tester, Elcometer 501 (Wolff-Wilborn test) uses graphite pencils, the smallest hardness that scratches the coating determines its hardness. Designed to test coating hardness by drawing with graphite pencils (6B - 6H) on the coating, according to standards ASTM D 3363, EN 13523-4, ISO 15184:2012, JIS K 5600-5-4, (ECCA T4).

Technical specification:

-

Usage area: material characterization and analysis

Keywords: Hardness tester, Wolff-Wilborn test

Description:

Salt (fog) spray corrosion test chamber can be used for all kinds of material surface treatment, including coating, electroplating, organic and inorganic coating, anodizing, rust proof oil and preservative treatment test of its corrosion resistance, so as to establish the quality of the products.

Technical specification:

test chamber capacity 108 L, Max volume of salt solution 15 L, test chamber size 107 × 60 × 118 cm, spray quantity 1.0~2.0 ml / 80 cm² / hour.

Usage area: mixing and chemical processing

Keywords: Salt spray, corrosion, test, fog

Description:

Four-point probe measurement system For measurement of sheet resistance and electrical conductivity

Technical specification:

voltage range 100 μV to 10 V, current range 1 μA to 200 mA, sheet resistance range 100 mΩ/□ to 10 MΩ/□, probe spacing 1,27 mm, max. sample dimensions 60 × 60 mm, max. sample thickness 10 mm, software Ossila Sheet Resistance Lite

Usage area: electrical measurement and testing

Keywords: Four-point probe measurement system, sheet resistance, electrical conductivity

Description:

Centrifuge 

Technical specification:

max. speed 10000 rpm, max. volume 6 × 100 ml, max. RCF 19040 g, timer 0 – 99 min, speed accuracy ± 20 rpm.

Usage area: mixing and chemical processing

Keywords: Centrifugation, centrifuge, phase separation

Description:

Vacuum drying oven For sample drying or storing at specific conditions 

Technical specification:

• Internal volume: 50 L
• Max. load: 20 kg
• Temperature range: ≥ 5 – 200 ⁰C
• Heating up to 150 ⁰C: 106 min
• Vacuum (absolute): < 6E-1 mbar

Usage area: heat treatment and thermal processing

Keywords: Vacuum, drying, oven, heating, thermal treatment, storing

Description:

The Nova II is a very versatile and sophisticated handheld laser power/energy meter.

• Large high definition LCD display
• Compatible with standard Ophir thermal, BeamTrack, pyroelectric & photodiode sensors
• Choice of digital or analog needle display
• Backlighting and rechargeable battery
• Soft keys and menu driven functions with on line help
• Non-volatile data storage up to 59,400 points

Technical specification:

• Available sensors: 
  • Photodiode (PD300)
    • P = 500 pW - 30 mW
    • λ = 0.35 - 1.1 um
  • Thermal (3A)
    • P = 10 μW - 3 W
    • λ = 0.19 - 20 um
• Analog out: 1, 2, 5, 10 V
• RS232: 30 Hz
• USB: 2000 Hz

Usage area: electrical measurement and testing

Keywords: laser power measurement, laser energy measurement

Description:

Rotary evaporators are mainly used in pharmaceutical, chemical and biopharmaceutical industries for efficient and gentle removal of solvents from samples by evaporation, and solvent recovery. Its advantages come from the fact that rotation of the flask artificially increases the surface area of the solvent and effectively suppresses bumping while decreased pressure facilitates rapid solvent removal at low temperatures. Evaporator has automated jacks and advanced temperature control features.

Technical specification:

speed range from 20 to 280rpm, and interval operation in clockwise and anticlockwise directions for drying process. 5L heating bath with wide temperature range from room temp. to 180°C. Digital display of both rotation speed and heating temperature allows for optimal control of all distillation processes. Patented condenser (cooling surface 1500cm²) with excellent cooling effect.

Usage area: mixing and chemical processing

Keywords: Rotary evaporator, solvent evaporation, recovery

Description:

Infrared thermometer 

Technical specification:

• Temperature range: 32 – 1100 °C
• Accuracy: 1.5 %
• Repeatability: 0.7 °C
• D:S ratio: 20:1
• Response time: 250 ms
• Adjustable emissivity: 0.1~1.0
• Spectral response: 8 – 14 μm
• Laser power: < 1 mW

Usage area: electrical measurement and testing

Keywords: Infrared, thermometer

Description:

The device is capable of analyzing the optical constants (k(λ), n(λ)) and measuring the thickness of thin layers, both isotropic and anisotropic, on a wide range of substrates, whether transparent or opaque. It is suitable for examining non-transparent materials as well. Additionally, the system supports the evaluation of periodic structures (scatterometry) and can be used to monitor absorption kinetics in liquids.

Technical specification:

• Spectral Range: UV-VIS-NIR
• Measurement Angles: 12°–90° with 0.01° resolution
• Focused Beam Size: 70 x 150 µm
• High-Resolution UV-VIS Detector:
  • Spectral Range: 190–900 nm
  • Resolution: 0.5 nm
• Fast UV-VIS Detector:
  • Spectral Range: 190–900 nm
  • 1024 wavelengths
• High-Resolution NIR Detector:
  • Spectral Range: 800–2000 nm
  • Resolution: 3 nm
• Automated Sample Positioning
• Sample Visualization: Digital camera

Usage area: material characterization and analysis

Keywords: Spectroscopic ellipsometer, optical constants, refractive index, absorption coefficient, extinction, dispersion, dispersion curve, thickness determination, ellispometer

Description:

Gloss meter Elcometer 480, 3 angles. Measures and records gloss, reflection and haze measurements on a variety of materials including paint, plastic, ceramic or metal.

Technical specification:

3 measurement modes: standard, automatic repeat and scan. Gloss, reflectance percentage or haze measurements, statistics, readings and differential with pass/fail, trend graphs and analog scan bars. Angles 20/60/85°. USB connection

Usage area: material characterization and analysis

Keywords: Gloss meter, reflectance

Description:

The SPS Polos 200 is a high-performance spin-coater designed for application of thin films onto substrates. It features customizable spin speeds and acceleration profiles, allows defining multiple process steps. The system accommodates a variety of substrates and coating materials, but is mostly used for spin coating resists for photolithography or electron beam lithography.

The system is installed in a class ISO5 cleanroom.

Technical specification:

• Spin speed: <10000 RPM
• Duration: 1-999 s
• Sample size: <150 mm (6")
• Hotplate temperature range: 50ºC - 250ºC
• Hotplate area: 230x230 mm2 

Usage area: thin film deposition and coating, micro- and nanofabrication

Keywords: nanofabrication, thin film, spin coating, lithography

Description:

KW-4A is a compact and easy-to-use spin coater for precise and uniform deposition of thin films and coatings. Its rugged, vibration-free and portable design makes it a versatile tool. A two-stage spin process allows dispensing at low speed and homogenizing the coating at high speed. The KW-4A spin coater can be used to deposit metal oxide thin films, polymer coatings and metal organic thin films. This product features a Teflon-coated stainless steel coating bowl. 

Technical specification:

• Centrifuge:
  • Two process steps (2-18 s and 3-60 s) with separate spin rates (500-2500 RPM; 1000-8000 RPM)
  • Sample size <6"
• Hotplate:
  • Temperature range 30-300 °C
  • Temeprature resolution 0.1 °C
• UV Curing:
  • 4 x 6 W lamps
  • Wavelengths 246 nm, 365 nm
  • Rotating sample (<4", 6 RPM)

Usage area: thin film deposition and coating

Keywords: spin-coater, hotplate, UV lamp, thin layers, spin coating, layer formation, UV hardening, UV cross linking, drying

Description:

The Raith e-Line Plus is an advanced electron beam lithography system designed for high-precision nanofabrication and nanoscale patterning. It features a versatile platform with a high-resolution electron beam column, capable of achieving feature sizes down to the sub-10 nanometer range. The Raith e-Line Plus has a user-friendly interface and comprehensive software suite, facilitating efficient and accurate design-to-device workflows. The system is also capable of scanning electron microscopy (SEM) and surface chemical analysis (EDX) from Be (Z=4) to Am (95).

The system is installed in a class ISO5 cleanroom.

Technical specification:

• Beam energy: 20 eV – 30 keV
• Beam current: 5 pA – 1.5 nA
• Writing speed: 0.125 Hz – 20 MHz pixel frequency
• Stage travel range/sample size: 100 mm (4")
• Beam size: >1.6 nm @ 20 keV
• Stitching accuracy: >40 nm (mean+3σ)

Usage area: holography and lithography, micro- and nanofabrication

Keywords: imaging, microscopy, scanning electron microscopy (SEM), X-ray energy dispersion spectroscopy (EDX, EDS), nanofabrication, lithography, exposure, e-beam lithography (EBL)

Description:

Optical microscope - Nikon Eclipse LV150N is a metallurgical microscope used for surface imaging. It operates in epi-illumination regime and has both bright field and dark field modes. Output can be switched between 10x oculars and a CCD camera. Polarizers are available for polarization contrast imaging.

The system is installed in a class ISO5 cleanroom.

Technical specification:

• Objectives: 5x, 20x, 50x, 100x
• Polarizer and analizer
• Bright field and dark field modes
• LED illumination
• CCD camera: 2448x2048 px

Usage area: microscopy and imaging

Keywords: imaging, microscopy

Description:

The OAI Hybralign Series 204IR is a mask aligner system used for parallel exposure wafers and wafer chips through a photomask to define microsctructures in UV sensitive resists. It features near-UV and deep-UV operating modes, an IR backside alignment system, and a UV nanoimprint add-on.

The system is installed in a class ISO5 cleanroom.

Technical specification:

• Soft and hard contact
• Substrate stage travel:
  • X, Y ±10mm
  • Z 1,500 μm
  • Rotation ±3.5˚
• Mask sizes: 4", 5"
• Wavelengths:
  • UV400: 350-450 nm (NUV)
  • UV300: 280-350 nm (NUV)
  • UV250: 240-260 nm (DUV)
• Lamp power: 500 W
• Shutter timer:
  • 0.1 - 99.0 s at 0.1 sincrements
  • 1 - 999 s at 1 s increments

Usage area: holography and lithography, micro- and nanofabrication

Keywords: nanofabrication, lithography, photolithography, exposure, nanoimprint lithography (NIL)

Description:

-

Technical specification:

-

Usage area: material characterization and analysis

Keywords: drop

Description:

The WinCamD-LCM is a laser beam profiling device from DataRay designed for precise measurement of laser beam diameter, profile, and intensity distribution. It features a high dynamic range CMOS sensor, capable of accurately measuring beams across a wide range from UV to IR. The WinCamD-LCM also comes with intuitive software that makes it easy to analyze and visualize laser beam properties.

Technical specification:

• Supports CW & pulsed beams
• Wavelength range: 355 to 1150 nm

Usage area: electrical measurement and testing

Keywords: laser beam, camera, imaging

Description:

Mixes PDMS

Technical specification:

-

Usage area: mixing and chemical processing

Keywords: mixing, PDMS

Description:

-

Technical specification:

-

Usage area: micro- and nanofabrication

Keywords: nanoparticles

Description:

Setup with the confocal micro-Raman optical system is devoted for Raman scattering spectra registration. Raman scattering spectroscopy can be used for the analysis of bulk materials, thin layers, powder and solutions. Unknown materials can be identified using the 8000 spectra containing spectral library. Measurements of various carbon allotropes (diamond-type carbon, graphene, graphene oxide), organic and inorganic materials, surface-enhanced Raman scattering measurements using silver or gold nanoparticles are performed.

Technical specification:

• 532 nm semiconductor laser:
  • Power: 45 mW
  • Grating: 2400 lines / mm
• 785 nm diode laser
  • Power: 100 mW
  • Grating: 1200 lines / mm  
• 1024 pixels thermoelectrically cooled CCD detector
• Stokes lines measuring range: 100 cm^-1 - 8000 cm^-1  
• Resolution: 1 cm^-1. 
• Leica confocal microscope:
  • Objectives: 5x, 20x, 50x and 100x
  • High speed encoded stage with step sizes down to 50 nm
• Spectral library containing 8000 spectra  

Usage area: material characterization and analysis

Keywords: Raman spectroscopy, materials research, identification

Description:

The coating system is designed for the formation of thin layers from solutions for polymers, liquid mixtures of nanoparticles and other solutions.

Technical specification:

• Coating speed: 0.1 mm/s - 50 mm/s
• Sample length: <100 mm, width <50 mm
• Heating <120 °C.

Usage area: thin film deposition and coating

Keywords: Slot die coating

Description:

-

Technical specification:

-

Usage area: electrical measurement and testing

Keywords: Measurement of gas sensors, photo sensors

Description:

Hardness tester, sclerometer Elcometer 3092, according to standard AS 3894.4 (EN 438-2, ISO 4586-2). Designed to test the hardness of the coating by drawing a tungsten carbide tip on the coating with a predetermined force.

Technical specification:

• 4 force scales: 0-3N, 0-10N, 0-20N, 0-30N

Usage area: material characterization and analysis

Keywords: Hardness tester, sclerometer

Description:

This scanning electron microscope (SEM) offers versatile imaging capabilities across various vacuum regimes, enabling high-resolution imaging of both conductive and non-conductive materials. Its ability to operate under different pressures, including high and low vacuum, as well as Environmental SEM (ESEM) conditions, makes it suitable for analyzing a wide range of samples with exceptional precision.

Technical specification:

• Resolution:
  • Up to 1.2 nm (30 kV, SE) in high vacuum
  • Up to 2.5 nm (30 kV, BSE) in high vacuum
  • Up to 3 nm (1 kV, SE) in high vacuum
• Vacuum Regimes:
  • High Vacuum: <6E-4 Pa
  • Low Vacuum: 10–130 Pa
  • ESEM: 10–4000 Pa
• Sample Compatibility: Suitable for both conductive and insulating samples

Usage area: material characterization and analysis, microscopy and imaging

Keywords: Microscope, magnification, visualization, scanning electron microscope, SEM, electron microscope, secondary electrons, back scattered electrons, environmental SEM, ESEM, field emission gun, FEG

Description:

The Leybold-Heraeus A700 sputtering tool is a versatile system designed for high-quality thin film deposition using DC sputtering. The system supports deposition of a wide range of metals. Its rotatable substrate holder ensures uniform coatings. Automated gas flow control and in situ monitoring provides precise control over film thickness and composition.

System is installed in a class ISO5 cleanroom.

Technical specification:

• Sputtering Process Type: DC sputtering
• Vacuum Range: High vacuum up to 1E-6 mbar
• Substrate Holder: Rotatable for uniform coating
• Target Materials: ...
• Deposition Rate: Adjustable, depending on material and process conditions
• Gas Flow Control: Automated MFC
• Film Thickness Control: In situ monitoring using quartz crystal microbalance
• Sample Size: Compatible with various substrate sizes

Usage area: thin film deposition and coating, micro- and nanofabrication

Keywords: nanofabrication, thin film, vacuum deposition, magnetron sputtering

Description:

ICP RIE system PlasmaTherm Apex SLR is used for the reactive ion etching of a variety of materials, most commonly Si/SiO2. It is equipped with fluorine-based gases and a cryo-cooled electrode, which enabled deep reactive ion etching (DRIE) of silicon. ICP RIE systems have two independent RF power supplies: one controls capacitive coupled plasma and the resulting self-bias, whereas the other supplies power to an antenna coil, inducing an inductively coupled plasma. This type of setup decouples the plasma density control (ICP) from the ion energy (CCP), allowing to achieve much higher etch rates without sacrificing selectivity. 

The system is installed in a class ISO5 cleanroom.

Technical specification:

• Gases: SF6, C4F8, CF4, O2
• Max flow rate: 100 sccm
• Max ICP Power: 1000 W
• Max CCP Power: 300 W
• Base pressure: ~5E-8 Torr
• Process pressure: 1 - 100 mTorr
• Electrode temperature range: -110ºC - 300ºC
• Maximum wafer size: 6"

Usage area: micro- and nanofabrication

Keywords: inductively coupled plasma (ICP), reactive ion etching (RIE), nanofabrication

Description:

The CUBIVAP thermal resistive evaporator is a reliable system designed for the efficient deposition of thin films via thermal evaporation. It is capable of evaporating a wide range of metals. The rotatable substrate holder ensures even film distribution, while precise control over deposition rates and film thickness is achieved through an integrated quartz crystal monitor.

The system is installed in a class ISO5 cleanroom.

Technical specification:

• Evaporation Method: Thermal resistive evaporation
• Vacuum Range: High vacuum up to 1E-6 mbar
• Source Material: Supports metals with melting temperature less than W
• Crucible Type: W
• Substrate Holder: Rotatable for uniform coating
• Deposition Rate: Adjustable, dependent on material and process parameters
• Film Thickness Control: Quartz crystal microbalance monitor
• Sample Size Compatibility: Accommodates various substrate sizes and types
• Process Control: Manual

Usage area: thin film deposition and coating, micro- and nanofabrication

Keywords: nanofabrication, thin film, vacuum deposition, resistive evaporation

Description:

The X-ray diffraction (XRD) device is designed for both qualitative and quantitative analysis of chemical compounds, offering precise insights into material composition. It enables ab initio crystal structure determination, helping to identify and clarify the atomic arrangement of compounds. The system is also adept at analyzing material microstructures, including crystallite sizes, micro-stress, and the degree of crystallinity. Advanced measurement capabilities include grazing incidence diffraction (GID) for surface analysis, micro-diffraction for localized studies, as well as small-angle reflectometry and high-resolution measurements for detailed material characterization. This versatility makes it an essential tool for research in materials science, chemistry, and solid-state physics.

Technical specification:

• 2.2 kW X-ray tube with Cu anode
• Parallel beam/ Bragg-Brentano geometry
• Göbel mirror
• 2xGe(022) crystal monochromator
• Rotary absorber
• Scintillation detector
• 1D LynxEye detector
• Eulerian cradle (X, Y, Z, Psi, Phi)
• Chi ir Xi motorized positioning table
• X-ray reflectivity acessory
• Motorized slit accessory
• PATHFINDER optics

Usage area: material characterization and analysis

Keywords: X-ray diffraction, structure, thin layers, analysis of chemical compounds

Description:

The JPK NanoWizard 3 scanning probe microscopy system is used for measuring surface topography and the mechanical, electrical, and magnetic properties of materials in both air and fluids. It is suitable for solids, polymers, biological samples, and molecular characterization, as well as for nanomanipulation and nanolithography. This system supports the development and research of advanced new materials and thin films, and it aids in the control of technological processes at the nanoscale.

The system is installed in a class ISO5 cleanroom.

Technical specification:

• Operating modes: 
  • contact, 
  • intermittent contact/AC/tapping, 
  • non-contact,
• Lateral force microscopy
• Phase imaging
• Force mapping
• Quantitative imaging: 
  • images of the surface force curve, 
  • the force-distance spectroscopy of force-distance volumetric imaging mode, 
  • conductivity microscopy
• Scanning field: <100x100 μm2
• Height: <15 μm

Usage area: material characterization and analysis, microscopy and imaging

Keywords: imaging, atomic force microscopy (AFM), topography, morphology, microscopy

Description:

The ThermoFisher ESCALAB 250Xi is an advanced surface analysis tool designed for both qualitative and quantitative investigations of material surfaces. Utilizing X-ray photoelectron spectroscopy (XPS), ion scattering spectroscopy (ISS), and reflection electron energy loss spectroscopy (REELS), this system provides comprehensive insight into surface chemistry and electronic structure. The addition of angle-resolved XPS (ARXPS) allows for depth profiling, while an Ar ion beam enables precise surface cleaning and etching.

Technical specification:

• X-Ray Source: Monochromated X-ray (Al anode)
• Element Detection Limits: 0.1% to 5%
• Lateral Resolution (Lens-Defined Area): Adjustable from 20 µm to 900 µm
• High-Resolution Imaging: Spectra from areas as small as ~5 µm
• Sample Temperature Control:
  • Heating up to 1000 K
  • Cooling down to 77 K
• Vacuum Performance: Better than 5E-10 mbar
• Surface Cleaning/Etching: Ar ion sputtering for surface preparation

Usage area: material characterization and analysis

Keywords: X-Ray photoelectron spectroscopy, ion scatering spectroscopy, electron spectroscopy, reflection electron energy loss spectroscopy, Angle Resolved XPS (ARXPS)

Description: null

Keywords: metal, dielectric, semiconductor, thin films, deposition by vacuum, plasma and ion assisted methods and investigations; structure, mechanical,electrical and optical properties

Description: null

Keywords: surface, nonostructures, nonocomposites, thin films

Description: null

Keywords: transient absorbtion

Description: null

Keywords: diamond like carbon

Description: null

Keywords: Centrifuge, spin coater

Description: null

Keywords: Langmuir-Blodgett method

Description: null

Keywords: semiconductor, surface, passivation

Description: null

Keywords: transmission, reflection

Description: null

Keywords: identefication

Description: null

Keywords: Surface roughness measurements

Description: null

Keywords: electrical properties

Description: null

Keywords: Micro-relief

Description:

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Keywords: Galvanoplastic

Description: null

Keywords: microscopy

Description: null

Keywords: Microhardness and other micromechanical properties

Description: null

Keywords: Schottky contacts, ohmic contacts

Description: null

Keywords: antireflective films

Description: null

Keywords: piezoresistive properties

Description:

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Keywords: conductivity, impedance spectroscopy, DC measurements

Description: The service provides original hologram fabrication in light sensitive recording media forming sub-micrometer size dimensional variable relief structures (or variable refractive index structures) for document security and brand authentication. Holograms are recorded using the physical object (model) or computer graphics supplied by the customer. Three-dimensional holograms (3D), 2D/ D holograms, hidden image holograms and combined hologram of high degree of protection recording are fabricated using optical tables, optical-mechanical components, controls, lasers and other devices. Combined hologram recording can be made by combining: a) 3D electron beam lithography with 2D/3D holograms, b) dot-matrix holograms with 2D / 3D holograms, c) 2D/3D holograms with hidden image holograms and so on.

Keywords: Laser interference lithography, hologram origination

Description:

The optical microscopy service offers imaging techniques for comprehensive morphological material surface characterization, including bright field, dark field, differential interference contrast (DIC), and fluorescence regimes. Both epi-illumination and transmission modes are available, ensuring versatility in sample visualization and analysis. Fluorescence microscopy enables the detection and study of specific fluorescent markers. For experiments requiring precise thermal control, a temperature-controlled sample stage is available, allowing for the observation of dynamic processes under varying conditions.

Keywords: microscopy, fluorescence, interference contrast, imaging

Description:

We can produce adhesive polymer film stickers (seals) of various sizes and shapes. The product is well suited for marking and sealing various devices, counters, computer equipment, household appliances, packaging, automotive devices and parts. The sticker adheres well to various surfaces (metal, plastic, wood). Obvious signs of damage can be seen upon tampering. If the sticker (seal) is intact, the user is assured that the package has not been opened, and the product inside is original and undamaged.

Additional sticker features:

• We can print texts and unique identification numbers on the sticker in the format chosen by the customer 
• Stickers disintegrate and leaves a mark upon tampering
• Standard sticker sizes in (mm): 7x14; 13x80; 14x14; 18x18; 25x25; R 12; R 18; R 25.

Keywords: seal, protection, tampering, stickers

Description: null

Keywords: Microsystems

Description:

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Keywords: lateral, magnetic, electric forces microscopy, mapping, mechanical properties, nanotechnology

Description:

Finite Element Modeling (FEM) service offers a comprehensive approach to simulate and analyze a wide array of physical phenomena, e.g., optics, nanophotonics, heat transfer, and structural mechanics. Using advanced computational techniques, we break down complex systems into smaller elements. The simple equations that model these finite elements are then assembled into a larger system of equations that models the entire problem allowing conclusions to be drawn about the behavior of complex systems. In structural mechanics, the simulation of mechanical responses within materials and structures helps predict stress distribution, deformation, and failure mechanisms under various loading conditions. For optics and nanophotonics, FEM modeling facilitates the understanding of light propagation, interaction with materials, and the behavior of electromagnetic waves at the nanoscale. In the domain of heat transfer, FEM allows for the precise analysis of thermal behavior within materials and systems. We predict temperature distributions, heat flow, and thermal stresses, aiding in the design of efficient cooling systems. 

Keywords: finite element method; modelling; simulation; physical phenomena

Description:

E-beam lithography is a sophisticated technique used to create extremely fine patterns on substrates by directing a focused beam of electrons onto a resist-coated surface. This technique allows for the precise control of feature sizes down to the nanometer scale, making it essential for fabricating advanced semiconductor devices and nanoscale structures. E-beam lithography is highly valued for its ability to produce custom and complex patterns with high resolution.

Keywords: nanofabrication, lithography, exposure, e-beam lithography (EBL)

Description:

Femtosecond laser micro- and nanofabrication system FemtoLab uses Yb:KGW laser Pharos, emitting 1030 nm, <4W, >270 fs pulses. Laser ablation can be performed using the fundamental wavelength, or higher harmonics (2H 515 nm, 3H 343 nm). Three ablation modes are available:

• laser beam ablation by moving the sample (position accuracy >100 nm, resolution >1 um, wavlenegths 1030 nm, 515 nm, 343 nm;
• laser beam ablation on flat and curved surfaces using a galvoscanner (resolution >20 um, wavelength 1030 nm);
• laser beam ablation using an interference field (periodicity 0.8-1.1 um, variable orientation, wavelength 515 nm).

Keywords: femtosecond laser, microfabrication

Description:

Cleanrooms are closed spaces with precise control of temperature, humidity, pressure, and the concentration of airborne particles. ISO 14644-1 standard describes 9 cleanroom classes based on the particle concetration. The cleanroom in "Santaka" valley is class ISO5, which means that there are <3520 particles of size >0,5 um per 1 m3 of air inside it. Standards also describe the rules for tool use, personnel protective garments and cleaning procedures to ensure the control of all the relevant ambient conditions. Such strict requirements result in a much higher device yield, especially those with functional elements on the order of micrometers or even nanometers.

Access to cleanroom requires passing a cleanroom introduction and chemical safety courses, as well as relevant tool training.

Keywords: cleanroom, process control

Description:

Optical lithography is a microtechnology process to structure thin films. The designed layout is exposed through a photomask on a UV-sensitive layer of photoresist coated on a wafer or a wafer chip. Depending on the photoresist polarity, exposed areas will either wash out or remain after a development step. Optical lithography allows to form >1 μm microstructures. 

Keywords: optical lithography, microfabrication

Description: null

Keywords: X-Ray photoelectron spectroscopy, ion scatering spectroscopy, electron spectroscopy, reflection electron energy loss spectroscopy

Description: null

Keywords: chemical bonds identefication

Description:

Reactive ion etching is performed using an inductively coupled plasma reactive ion etching tool PlasmaTherm Apex SLR (up to 6").

Keywords: inductively coupled plasma (ICP), reactive ion etching (RIE), nanofabrication

Description: null

Keywords: Laser ellipsometer